Comment by pcdoodle

I'm not too sure but I would assume there's going to be faster turn prototype chips in the USA now? Is packaging needed to prove a prototype? Can we start buying IP blocks and make our own ICs? I'd love a MCU with built in IMU and wide range LDO, not sure if that's possible all on the same node.

There's going to be some niches opening as a result of this IMO.