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Comment by mlsu

3 days ago

The issue with consolidating a BLDC driver is thermals more than anything else, right? Much easier to keep the MOSFETs cool if they aren't packed in on chip. Plus you can customize their size to the load.

Yeah, for most applications it's preferred that way. It's only for the ultra-compact, ultra high volume production, ultra high energy densities that packing it all into a single, unobody die and package could make sense. It would offer minor benefits anyway. Only when every gram, watt and mm3 counts would it be worth even thinking about. Maybe for very large vehicles (trucks, boats) or extremely small applications it would make more sense?