Comment by carter2099

I sent this to someone I know knowledgeable about this type of thing, here’s what he had to say, sharing because I thought it was interesting:

Pretty cool tech, silicon is very advanced. That said, this is how every wafer comes out of the fab. This process does not dice out individual chips but instead adds interonnects. I doubt they have 100% yield, but probably just don't connect that die. This type of setup is one of the reasons Apple's M series chips are so effective. Their CPU/GPU/RAM are all on one die/directly interconnected instead of going through some motherboard based connector. I think Apple doesn't have them all go through the same process so those are connected via a different process but same layed on silicon direct connection. This solves the problem data centers tend to have of tons of latency for the connections between processors. This is also similar to AMD's infinity fabric of their Zen architecture. It's cool how all of these technologies build from another.

It's also all reliant on fab from TSMC who did the heavy lifting is making the process a reality