Comment by StingyJelly
14 hours ago
>it's even more tightly bound than just being soldered on
No. There is a reason for it but no, it's just soldered on the same carrier board as the APU, in order to be really close to it. Apple could have used a form factor like CAMM2 and it would have worked the same, be it at slightly higher cost. The reason is simply to kill upgrade options and cut manufacturing costs - same as for any other soldered ram.
I think it’s possible that Apple will support LPCAMM2 assuming it can done without risking the SOC but it is too cutting edge single vendor technology for them to be implementing it now.