Comment by monocasa
2 months ago
Ok, part of my confusion was that it was being presented in contrast to InFO-oS and InFO-PoP, but it appears to mostly be a modified version of InFO-PoP called InFO-M? Because Apple has been using InFO-PoP for almost a decade at this point, starting with the A10.
Apple has not shipped an InFO-PoP with side-by-side integrated die yet. This is expected to be the first one, using RDLs for the die-to-die interconnect (so different than M-Ultra series that uses silicon bridges).