Comment by alephnerd

Bad take.

Design capacity doesn't imply fabrication capacity, as can be seen with Israel and India's comparative dominance in the chip design industry.

Design capacity (basically programming and logic design) is orthogonal to front-end fabrication (basically material science and chemical engineering) which is orthogonal to back-end/OSAT (basically materials science and metrology).

Only the US and Taiwan have domestic E2E capacity in all 3.