← Back to context Comment by reliabilityguy 4 hours ago HBM is a stack of DRAMs, so there is no “instead”. 2 comments reliabilityguy Reply buckle8017 4 hours ago The vias to enable stacking is a significant amount of the die area. saltcured 3 hours ago If they're talking about production capacity, that is some product of die area and process steps, right? It doesn't have to be 3x die area, just 3x lower factory throughput for the same number of functioning memory bits.
buckle8017 4 hours ago The vias to enable stacking is a significant amount of the die area. saltcured 3 hours ago If they're talking about production capacity, that is some product of die area and process steps, right? It doesn't have to be 3x die area, just 3x lower factory throughput for the same number of functioning memory bits.
saltcured 3 hours ago If they're talking about production capacity, that is some product of die area and process steps, right? It doesn't have to be 3x die area, just 3x lower factory throughput for the same number of functioning memory bits.
The vias to enable stacking is a significant amount of the die area.
If they're talking about production capacity, that is some product of die area and process steps, right? It doesn't have to be 3x die area, just 3x lower factory throughput for the same number of functioning memory bits.