Comment by Const-me
4 hours ago
See remark on the slide 11: https://www.servethehome.com/micron-evolving-memory-architec... That presentation is by Micron.
4 hours ago
See remark on the slide 11: https://www.servethehome.com/micron-evolving-memory-architec... That presentation is by Micron.
It doesn't really say that it needs to use 3x more area, but that 3x more gets consumed due to "advanced packaging and manfuacturing complexity". Which doesn't properly explain why it consumes 3x more and could simply mean they have a bad yield and 2/3 produced is garbage.
> 2/3 produced is garbage.
This might not be far off the mark. You are irreversibly linking the fates of these devices after a certain stage of manufacturing. If something goes wrong at final packaging time, you lose all dies instead of one.
Yea, that's the question. Yield situation can improve. Area overhead would not improve short of a completely new and incompatible tech.
direct link: https://www.servethehome.com/micron-evolving-memory-architec...
Yuck. Time to build an xSPI/HyperRAM workstation (if only these had multi-bank chips).
Sadly the $ per byte of xSPI and HyperRAM quite high
1 reply →