Comment by HarHarVeryFunny

Actually CXMT make both standard HBM3E, and also Huawei's custom HiBL and HiZQ non-JEDEC-standard HBM variants.

As I understand it, yields are different for all three:

25% for standard 8-Hi HBM3E

45-50% for HiZQ (used for Huawei's Ascend 950DT decode/training chip)

75-80% for HiBL (used for Huawei's Ascend 950PR prefill chip)

HiBL yield is best because it only users 4 layers, resulting in lower memory bandwidth (prefill is more dependent on compute than memory).

HiZQ uses 8 layers same as their 8-Hi HBM3E, but is higher yield due to using a Huawei specific base logic die that relaxes a lot of the specifications.