Comment by FlowingRiver
3 hours ago
Interesting. LogicFolding is something that seems so obvious in retrospect and yet somebody has to be the first to do it.
I did find it neat that it ends up actually reducing overall heat despite the multiple layer wafers as signals have less overall distance to travel as they move in layer space rather than across the chip.
It moved the complexity from lithography to alignment
But how can they patent this, as 3D chips have been built for decades already?
I mean, it is nice that they found out some properties (lower heat than expected), but you cannot patent that, I suppose.