Comment by FlowingRiver

It is probably like a lot of patents, some very specific details on design and the technology of interconnects between layers.

Chips have been multiple layers since the beginning practically but it was also laid out in a somewhat 2D fashion of ALU here, FPU there, cache somewhere else, but now they are stacking functionality so that is isn't so discrete, in a 2D space it would get a little fuzzy.

It isn't mind blowing ground breaking stuff but it is very cool. Evolutionary not revolutionary.