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Comment by dgfitz

5 days ago

Until 2027, yes.

https://www.tomshardware.com/pc-components/gpus/tsmc-is-repo...

"TSMC does not have an advanced packaging facility in the U.S., and its partner Amkor will only start packaging chips in Arizona in 2027. As a result, Blackwell AI silicon produced in Arizona will need to be shipped back to Taiwan for final assembly, as all of TSMC's CoWoS packaging capacity remains in Taiwan."

Given that there may be a 25% chance that China invades Taiwan by 2030, having the ability to package SOTA chips in the US by 2027 seems "soon enough".