You are correct. I was just illustrating what kind of processes belong to the umbrella term "packaging" in the context of semiconductor manufacturing. Was not talking about what particular process are missing from the Arizona facility.
But you are right on that it is CoWoS which is the missing ingredient.
You are correct. I was just illustrating what kind of processes belong to the umbrella term "packaging" in the context of semiconductor manufacturing. Was not talking about what particular process are missing from the Arizona facility.
But you are right on that it is CoWoS which is the missing ingredient.