Comment by jauntywundrkind
13 days ago
> To address these challenges, we highlight four architecture research opportunities: High Bandwidth Flash for 10X memory capacity with HBM-like bandwidth; Processing-Near-Memory and 3D memory-logic stacking for high memory bandwidth; and low-latency interconnect to speedup communication.
High Bandwidth Flash (HBF) got submitted 6 hours ago! It's a great article, fantastic coverage of a wide section of the rapidly moving industry. https://blocksandfiles.com/2026/01/19/a-window-into-hbf-prog...
HBF is about having many dozens or hundreds of channels of flash memory. The idea of having Processing Near HBF, spread out, perhaps in mixed 3d design, would be not at all surprising to me. One of the main challenges for HBF is building improved vias, improved stacking, and if that tech advanced the idea of more mixed NAND and compute layers rather than just NAND stacks perhaps opens up too.
This is all really exciting possible next steps.
Why is persistence such a big thing here? Non-flash memory just needs a tiny bit of power to keep its data. I don't see the revolutionary usecase.
Density is the key here, not persistence.
Thanks! This explains it.
Now I'm wondering how you deal with the limited number of write cycles of Flash memory. Or maybe that is not an issue in some applications?
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