Cerebras has effectively 100% yield on these chips. They have an internal structure made by just repeating the same small modular units over and over again. This means they can just fuse off the broken bits without affecting overall function. It's not like it is with a CPU.
I suggest to read their website, they explain pretty well how they manage good yield. Though I’m not an expert in this field. I does make sense and I would be surprised if they were caught lying.
Defects are best measured on a per-wafer basis, not per-chip. So if if your chips are huge and you can only put 4 chips on a wafer, 1 defect can cut your yield by 25%. If they're smaller and you fit 100 chips on a wafer, then 1 defect on the wafer is only cutting yield by 1%. Of course, there's more to this when you start reading about "binning", fusing off cores, etc.
There's plenty of information out there about how CPU manufacturing works, why defects happen, and how they're handled. Suffice to say, the comment makes perfect sense.
Sure it does. If it’s many small dies on a wafer, then imperfections don’t ruin the entire batch; you just bin those components. If the entire wafer is a single die, you have much less tolerance for errors.
The bigger the chip, the worse the yield.
Cerebras has effectively 100% yield on these chips. They have an internal structure made by just repeating the same small modular units over and over again. This means they can just fuse off the broken bits without affecting overall function. It's not like it is with a CPU.
I think what you’re saying is that every wafer is usable, but won’t have the same performance characteristics, depending on how many bits are broken.
Doesn’t that just bucket wafers based on performance? Which effectively gives a yield to each bucket.
I suggest to read their website, they explain pretty well how they manage good yield. Though I’m not an expert in this field. I does make sense and I would be surprised if they were caught lying.
This comment doesn't make sense.
One wafer will turn into multiple chips.
Defects are best measured on a per-wafer basis, not per-chip. So if if your chips are huge and you can only put 4 chips on a wafer, 1 defect can cut your yield by 25%. If they're smaller and you fit 100 chips on a wafer, then 1 defect on the wafer is only cutting yield by 1%. Of course, there's more to this when you start reading about "binning", fusing off cores, etc.
There's plenty of information out there about how CPU manufacturing works, why defects happen, and how they're handled. Suffice to say, the comment makes perfect sense.
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Sure it does. If it’s many small dies on a wafer, then imperfections don’t ruin the entire batch; you just bin those components. If the entire wafer is a single die, you have much less tolerance for errors.
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Bigger chip = more surface area = higher chance for somewhere in the chip to have a manufacturing defect
Yields on silicon are great, but not perfect
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You say this with such confidence and then ask if smaller chips require smaller wafers.