Comment by selectodude
11 hours ago
HBM is just DRAM stacked directly next to the die. The expensive part is gluing it on there. The chips themselves are pretty much the same.
11 hours ago
HBM is just DRAM stacked directly next to the die. The expensive part is gluing it on there. The chips themselves are pretty much the same.
HBM uses about twice as much DRAM silicon per GB due to all the space for interconnect