Apple has historically been able to keep prices the same even when everyone expected them to increase. Not a great sign that even Apple, with supply/pricing usually locked up years in advance, has to raise prices.
This question bothers me because I have never found a clear authoritative documentation.
The more detailed sources say, contra the mainstream impression, that Apple Silicon's vaguely-named "unified memory" is technically a hybrid System-on-Chip and System-in-Package architecture. The memory banks DRAM are on a second die (one source said it is made by Samsung), but the RAM controller sits on the CPU die and manages the RAM for the unified memory pool for graphics/main/neural memory usage (hence, "unified" from an ISA perspective). Both IC dies coexists on a shared enclosed package as a single microchip. Technically this is still called a System-on-Chip architecture according to Wikipedia because the electrical engineering definition allows for some parts, such as RAM or I/O, to still exist separately off the main piece of silicon die yet still be called an SoC architecture. In short, it is not a monolithic SoC.
I have tried several times to find citations about this but it is an ambiguous point that is often glossed over, as a kind of hardware abstraction.
Apple has historically been able to keep prices the same even when everyone expected them to increase. Not a great sign that even Apple, with supply/pricing usually locked up years in advance, has to raise prices.
I thought they fabbed RAM on-chip.
This question bothers me because I have never found a clear authoritative documentation.
The more detailed sources say, contra the mainstream impression, that Apple Silicon's vaguely-named "unified memory" is technically a hybrid System-on-Chip and System-in-Package architecture. The memory banks DRAM are on a second die (one source said it is made by Samsung), but the RAM controller sits on the CPU die and manages the RAM for the unified memory pool for graphics/main/neural memory usage (hence, "unified" from an ISA perspective). Both IC dies coexists on a shared enclosed package as a single microchip. Technically this is still called a System-on-Chip architecture according to Wikipedia because the electrical engineering definition allows for some parts, such as RAM or I/O, to still exist separately off the main piece of silicon die yet still be called an SoC architecture. In short, it is not a monolithic SoC.
I have tried several times to find citations about this but it is an ambiguous point that is often glossed over, as a kind of hardware abstraction.
No, they're regular LPDDR dice from one of the big manufacturers that are mounted on the same package as the SoC.
Is there a citation for this? I've found that the majority of Google searches tend to gloss over this hardware detail.
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so what have consumers gained from the 'A.I' boom ?
kids missing out on games - cz Switch prices went up.
regular joes - consumer hardware went up at least 50% from RAM, SSDs & other components
I guess regular joes gained the ability to 'chat' with a stochastic parrot & vibe code useless things.
Don’t forget senior management salivating about laying you off.
I probably couldn’t (wouldn’t) run NixOS without it.
We got lot of buggy sloppy softwares.